Eindhoven University of Technology (TUE) and NXP have announced a collaboration to jointly develop 300 GHz technology. In the letter of intent signed this week, both parties agree to make knowledge and data as well as the necessary employees and students available through a new roadmap, to make major future strides in the speed, efficiency and stability of information transfer using this wireless communication method.
“The TUE’s proven track record in collaborations with industry gives us full confidence to expand our cooperation in new research areas focused on communication and sensing systems. This will lead to new innovations in communication technologies and advanced driver assistance systems, a domain in which NXP is the world’s leading semiconductor provider. With advanced driver assistance systems, we aim to contribute to reducing the over a million fatalities in traffic each year globally,” says NXP CTO Lars Reger.
Carrier frequencies above 200 GHz are seen as key to enabling wireless communication networks with 100 Gb/s wireless data rates and the many applications that would benefit from such high data rates. A downside is that such extremely high-frequency waves suffer from attenuation due to absorption by the atmosphere and objects.
The research of NXP and TUE will focus on the design of the high-frequency ICs, which require transistors based on other materials than silicon because the latter can’t handle the frequencies involved.