The world’s 300mm fab capacity is on the rise


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Semiconductor manufacturers worldwide are forecast to expand 300mm fab capacity at a nearly 10 percent compound average growth rate (CAGR) from 2022 to 2025, reaching 9.2 million wafers per month (wpm), Semi predicts. Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.

New fabs announced by companies including Globalfoundries, Intel, Micron, Samsung, Skywater Technology, TSMC and Texas Instruments are boosting fab capacity.

“While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300mm fab capacity,” said Ajit Manocha, Semi president and CEO. “SEMI is currently tracking 67 new 300mm fabs or major additions of new lines expected to start construction from 2022 to 2025.”