Infineon announces €5B 300mm fab in Dresden

Infineon’s supervisory board has approved plans to build a new 300mm fab in Dresden. The 5-billion-euro facility, scheduled to commence production in 2026, will manufacture analog/mixed-signal and power semiconductors. “Decarbonization and digitalization are causing a structurally increasing demand for semiconductors. This dynamic has further accelerated, so now is the right time for us to define an even more ambitious target operating model,” comments CEO Jochen Hanebeck. Construction hinges on government support through the European Chips Act, but Hanebeck says he has “political support.”