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Global semiconductor capacity projected to reach record high in 2024

Paul van Gerven
Leestijd: 1 minuut

Global semiconductor capacity is expected to increase 6.4 percent in 2024 to top the 30 million wafers per month (200 millimeter equivalent) mark for the first time, according to the World Fab Forecast published by Semi. The 2024 growth will be driven by capacity increases in leading-edge logic and foundry, applications including generative AI and high-performance computing (HPC), and the recovery in end demand for chips. The capacity expansion slowed in 2023 due to softening semiconductor market demand and the resulting inventory correction.

New semiconductor fabs starting operations. Source: Semi World Fab Forecast, Q4 2023 update

“Resurgent market demand and increased government incentives worldwide are powering an upsurge in fab investments in key chipmaking regions,” says Semi CEO Ajit Manocha. “The heightened global attention on the strategic importance of semiconductor manufacturing to national and economic security is a key catalyst of these trends.”

Covering 2022-2024, the WFF report shows that the global semiconductor industry plans to begin the operation of 82 new volume fabs, including 11 projects in 2023 and 42 projects in 2024, spanning wafer sizes ranging from 300 to 100 mm. With 18 projects in 2024 and 13 percent capacity growth, China is leading the industry’s expansion. Taiwan comes in second with five fabs and 4.2 capacity growth this year. Korea ranks third with four fabs and 2 percent growth.

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